APPLICATION ANALYSIS / INDUSTRIAL
Antistatic PS Electronics Tray Application Analysis
This application analysis covers a PS tray used to position electronic parts through handling, assembly or transport. Tonghou projects target 10⁹–10¹¹ Ω surface resistance for this antistatic direction; the test method, conditioning environment, measurement locations, geometry and required service life remain project-specific acceptance decisions.
Engineering application analysis, not a named customer result · Published and updated: August 16, 2026
01
Packaging requirement
Organize components, control movement and support process handling while meeting the agreed antistatic requirement.
02
Principal risks
- Incorrect ESD classification
- Part movement or contact with sensitive zones
- Resistance results measured under different conditions
03
Material rationale
Antistatic PS supports formable process trays with a target surface-resistance range of 10⁹–10¹¹ Ω, subject to the agreed test method and environment.
04 / STRUCTURE
Structural design checkpoints
- Match cavities to part orientation and sensitive zones
- Provide removal clearance for the actual process
- Define stacking and transfer behavior without loading the components
05 / VALIDATION
Sampling and validation
Agree the resistance range, method, conditioning, measurement locations and acceptance criteria, then verify fit and handling with representative parts.
06 / BUYER INPUT
Inputs for project assessment
- Part dimensions, weight and orientation
- Sensitive zones and process flow
- ESD standard and test method
- Temperature, humidity and expected service life
07 / BUYER QUESTIONS
Common buyer questions
01What surface resistance is targeted?
The target range is 10⁹–10¹¹ Ω, subject to the agreed measurement method and environment.
02Is antistatic the same as conductive?
No. The required ESD classification must be stated explicitly.
03Why specify humidity and conditioning?
They can influence measured resistance and therefore the acceptance result.